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发信人: sucky (这念/'suki/,不要念错哦), 信区: material
标 题: 材科讲义(4)
发信站: 听涛站 (2001年06月06日18:20:36 星期三), 站内信件
Chapter 4 Recovery & Recrystallization
?1. Introduction
1. Changes after cold-working
l Microstructure
(1) grain shape, crystallographic orientation (texture)
(2) density of defects (dislocations and vacancies)
l Internal stress (deviation of lattice constants from the equilibrium value
s)
long-range: >>grain size ? type I
~ grain size ? type II
short-range: localized distortion ? type III
(vacancy, dislocation, >80% rEs)
l Properties
mechanical physical chemical
strain hardening(s, d) electric, magnetic corrosion resistance
2. Other causes to internal stress
l phase transformation
l machining ( grinding 机加工,磨)
l un-uniform cooling (casting, welding)
3 Change to more equilibrium states
(1) conditions
a. Thermodynamics
l Stored internal energy: Du=DQ+W
l Driving force: DG " Du
(DV " 0, DH " Du, TDS <<DH)
l Measurement: power difference DP
(required to heat the worked, annealed specimens)
b. Kinetics
l Q = thermal activation energy
required to enhance atomic diffusion so that atoms can arrange themselves to
a more equilibrium state.
l The process obeys Arrhenius- type law
rate = A'e-Q/RT
or 1/t = A e-Q/RT Eq.(10-26)
consistent with many reactions
(2) Process (annealing)
a. Recovery
no grain shape change
type I & II stress relief 应力松弛
release of part of DEs (=Du) 能量释放
some changes of properties
b. Recrystallization
l new grains growth at expense of deformed structure
l complete release of DEs
l reversion of properties 性能复原
c. Grain growth
l grain growth at expense of other new grains
In-depth understanding is a step to tailor the microstructure for optimizing
the desired properties by process design.
Only for steels (四把火), for other materials are different
l annealing 退火 (A炉冷), to soften
l normalizing 正火 (A空冷), to refine
l quenching 淬火 (A速冷), to gain martensite马氏体
l tempering 回火 (M'空冷或速冷), to toughen
?2 Recovery
1 Mechanism
a. low T 0.1~0.3Tm (K)
disappearance and migration of vacancies
to dislocations, grain boundaries, or to surface
b. medium T 0.3~0.5Tm
reaction, rearrangement and elimination of dislocations to from a cell struc
ture 胞状结构
l tangled dislocations at cell walls 位错缠结
l depending on energy of stacking faults
c. high T >0.5Tm
Formation and coalescence(粗化) of subgrains (亚晶)
Two process:
l polygonization 多边形化
merging of subgrains q+q=2q
l sharpness of cell structure
rotation of subgrains
2. Kinetics
l feature: thermal activated process
Follow Arrhenius-type law
l for a given recovered property 1-x
x = fraction of un-recovered property
For a first-order rate process: d(1-x)/dt = kx
lnx - c = -A0exp(-Q/RT)t
t vs T : or lnt = Q/RT + B
p519
If x = b - lnt then Q = Q0- cx \X Q
l main application
stress relief
reduce tendency of stress corrosion cracking
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